In the semiconductor and microfabrication industry, silicon wafers serve as the fundamental substrate material. The arrangement of silicon atoms defines the wafer’s crystal orientation, which significantly influences device performance, processing methods, and fabrication precision.

This article provides a comprehensive overview of the three most common silicon wafer orientations—<100>, <110>, and <111>—highlighting their structural characteristics and typical applications to help you select the most suitable material for your specific needs.

1. What Is Crystal Orientation?

Crystal orientation describes the direction of atomic alignment within a single-crystal silicon substrate. Silicon wafers are typically sliced along specific crystallographic planes, such as <100>, <110>, or <111>. Each orientation exhibits different atomic densities, bonding configurations, and surface energies, which affect the fabrication process and device behavior.

2. <100> Orientation — The Standard Choice for Integrated Circuits

Atomic arrangement is uniform and surface is flat.

High electron mobility, beneficial for device performance.

Exhibits strong anisotropic etching behavior, enabling well-defined V-groove structures.

Common applications: CMOS, integrated circuits (ICs), and MEMS fabrication.

3. <110> Orientation — Preferred for Power Devices and Vertical Structures

High surface atomic density with superior hole mobility.

Suitable for fabricating vertical sidewalls and precise structures.

Generally slower etching rate in specific directions.

Typical applications: Insulated Gate Bipolar Transistors (IGBTs), power MOSFETs, and 3D MEMS devices.

4. <111> Orientation — Ideal for Optoelectronics and High-Stability Structures

The densest atomic packing with the most stable crystal surface.

Often serves as an etch stop plane due to its slow etching rate.

Excellent surface flatness, suitable for optical components and mirror-like structures.

Used in: photodetectors, micro-mirrors, and specialized MEMS devices.

5. Comparative Summary
 

Orientation	Atomic Density	Electron Mobility	Hole Mobility	Etching Behavior	Typical Applications
<100>	Moderate	High	Moderate	Fast anisotropic etching	CMOS, IC, MEMS
<110>	High	Moderate	High	Suitable for vertical structures	Power devices, 3D MEMS
<111>	Highest	Moderate	Moderate	Slow etching, etch stop plane	Optoelectronics, mirror structures

6. JXT Offers a Full Range of Silicon Wafer Orientations

JXT Technology Co., Ltd. supplies high-quality silicon wafers with <100>, <110>, and <111> orientations. We offer wafer sizes ranging from 2-inch to 12-inch, with customization options including thickness, doping type (N-type/P-type), orientation slicing, and polishing services.

For specific requirements or quotations, please feel free to contact us for expert technical support.